Using Anisotropic Silicon Etch for Change the Crystal Orientation of Silicon Wafer
In this work، anisotropic silicon etch using KOH ، optical microscopic and X-ray diffraction testing، were used to determine the crystal orientation of the silicon wafer(100) plane , where the mechanical polishing and wet etching described the geometric dislocations pits which refers to the crystall...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Unviversity of Technology- Iraq
2012-04-01
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| Series: | Engineering and Technology Journal |
| Online Access: | https://etj.uotechnology.edu.iq/article_56876_51cdc47f659c17b8e771c97295f312fa.pdf |