Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction Analysis

Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction Analysis

Compressive residual stresses generated during thin film deposition may lead to undesirable film damage, such as delamination, buckling, and flaking, ultimately leading to the failure of the device employing the film. Understanding the residual stress generation and role in these damage mechanisms i...

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Bibliographic Details
Main Authors: Haikun Jia, Shi Bin Wang, Nobumichi Tamura, Philippe Goudeau
Format: Article
Language:English
Published: MDPI AG 2018-12-01
Series:Quantum Beam Science
Subjects:
metallic thin films
residual stresses
delamination
synchrotron X-ray diffraction
finite element method (FEM)
strain/stress measurements
Online Access:https://www.mdpi.com/2412-382X/3/1/1

Internet

https://www.mdpi.com/2412-382X/3/1/1

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