Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction Analysis
Compressive residual stresses generated during thin film deposition may lead to undesirable film damage, such as delamination, buckling, and flaking, ultimately leading to the failure of the device employing the film. Understanding the residual stress generation and role in these damage mechanisms i...
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| Format: | Article |
| Language: | English |
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MDPI AG
2018-12-01
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| Series: | Quantum Beam Science |
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| Online Access: | https://www.mdpi.com/2412-382X/3/1/1 |
| _version_ | 1798030980159635456 |
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| author | Haikun Jia Shi Bin Wang Nobumichi Tamura Philippe Goudeau |
| author_facet | Haikun Jia Shi Bin Wang Nobumichi Tamura Philippe Goudeau |
| author_sort | Haikun Jia |
| collection | DOAJ |
| description | Compressive residual stresses generated during thin film deposition may lead to undesirable film damage, such as delamination, buckling, and flaking, ultimately leading to the failure of the device employing the film. Understanding the residual stress generation and role in these damage mechanisms is necessary to preserve thin film integrity and optimize its functional properties. Thin shell theory has been used for decades to predict buckling but the results have not yet been correlated with experimental data since the techniques used to measure stress in metallic films were not able to do so at the required micron scale until recently. Micro scanning X-ray diffraction now enables the direct mapping of the local stress of metallic films. In this paper, finite element method based on thin shell theory and synchrotron X-ray micro diffraction have been used to determine stress maps of thin film buckling patterns. Calculations of the stress distribution in the metallic films have been performed taking into account the buckling geometry determined from optical measurements. Stress distributions over gold blisters and tungsten wrinkles obtained with the two techniques are in fair agreement and allow for the accurate determination of the stress relaxation profile from the bottom to the top of the buckling, validating the thin shell theory model. |
| first_indexed | 2024-04-11T19:48:56Z |
| format | Article |
| id | doaj.art-21b7c30ffb25474e973b5208d802e813 |
| institution | Directory Open Access Journal |
| issn | 2412-382X |
| language | English |
| last_indexed | 2024-04-11T19:48:56Z |
| publishDate | 2018-12-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Quantum Beam Science |
| spelling | doaj.art-21b7c30ffb25474e973b5208d802e8132022-12-22T04:06:21ZengMDPI AGQuantum Beam Science2412-382X2018-12-0131110.3390/qubs3010001qubs3010001Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction AnalysisHaikun Jia0Shi Bin Wang1Nobumichi Tamura2Philippe Goudeau3China Electric Power Research Institute, N°15, Xiaoying Rd(E), Qinghe, Beijing 100192, ChinaDepartment of Mechanics, Tianjin University, Tianjin 300072, ChinaAdvanced Light Source-Lawrence Berkeley National Laboratory (ALS-LBNL), 1 Cyclotron Road, MS 2-400, Berkeley, CA 94720, USAInstitut Pprime, UPR 3346 CNRS-Université de Poitiers - ENSMA, BP 30179, 86962 Futuroscope, FranceCompressive residual stresses generated during thin film deposition may lead to undesirable film damage, such as delamination, buckling, and flaking, ultimately leading to the failure of the device employing the film. Understanding the residual stress generation and role in these damage mechanisms is necessary to preserve thin film integrity and optimize its functional properties. Thin shell theory has been used for decades to predict buckling but the results have not yet been correlated with experimental data since the techniques used to measure stress in metallic films were not able to do so at the required micron scale until recently. Micro scanning X-ray diffraction now enables the direct mapping of the local stress of metallic films. In this paper, finite element method based on thin shell theory and synchrotron X-ray micro diffraction have been used to determine stress maps of thin film buckling patterns. Calculations of the stress distribution in the metallic films have been performed taking into account the buckling geometry determined from optical measurements. Stress distributions over gold blisters and tungsten wrinkles obtained with the two techniques are in fair agreement and allow for the accurate determination of the stress relaxation profile from the bottom to the top of the buckling, validating the thin shell theory model.https://www.mdpi.com/2412-382X/3/1/1metallic thin filmsresidual stressesdelaminationsynchrotron X-ray diffractionfinite element method (FEM)strain/stress measurements |
| spellingShingle | Haikun Jia Shi Bin Wang Nobumichi Tamura Philippe Goudeau Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction Analysis Quantum Beam Science metallic thin films residual stresses delamination synchrotron X-ray diffraction finite element method (FEM) strain/stress measurements |
| title | Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction Analysis |
| title_full | Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction Analysis |
| title_fullStr | Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction Analysis |
| title_full_unstemmed | Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction Analysis |
| title_short | Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction Analysis |
| title_sort | stress relaxation related to spontaneous thin film buckling correlation between finite element calculations and micro diffraction analysis |
| topic | metallic thin films residual stresses delamination synchrotron X-ray diffraction finite element method (FEM) strain/stress measurements |
| url | https://www.mdpi.com/2412-382X/3/1/1 |
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