Nondestructive Wafer Level MEMS Piezoelectric Device Thickness Detection

Nondestructive Wafer Level MEMS Piezoelectric Device Thickness Detection

This paper introduces a novel nondestructive wafer scale thin film thickness measurement method by detecting the reflected picosecond ultrasonic wave transmitting between different interfacial layers. Unlike other traditional approaches used for thickness inspection, this method is highly efficient...

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Bibliographic Details
Main Authors: Yongxin Zhou, Yuandong Gu, Songsong Zhang
Format: Article
Language:English
Published: MDPI AG 2022-11-01
Series:Micromachines
Subjects:
picosecond ultrasound
nondestructive thickness measurement
MEMS piezoelectric device/sensor
scandium doped aluminum nitride (AlScN)
Online Access:https://www.mdpi.com/2072-666X/13/11/1916

Internet

https://www.mdpi.com/2072-666X/13/11/1916

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