Microstructural evolution of joints with and without Sb, Ni in Sn58Bi solder under electro-thermal-force coupling
Severe atomic migration occurs in the solder under the effect of multi-physics field coupling, leading to serious reliability problems. Under the influence of multi-physics field coupling, severe atomic migration occurs in solder, resulting in significant reliability issues. In Cu/Sn58Bi/Cu joints s...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-09-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423018136 |