Microstructural evolution of joints with and without Sb, Ni in Sn58Bi solder under electro-thermal-force coupling

Microstructural evolution of joints with and without Sb, Ni in Sn58Bi solder under electro-thermal-force coupling

Severe atomic migration occurs in the solder under the effect of multi-physics field coupling, leading to serious reliability problems. Under the influence of multi-physics field coupling, severe atomic migration occurs in solder, resulting in significant reliability issues. In Cu/Sn58Bi/Cu joints s...

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Bibliographic Details
Main Authors:	Xuefeng Wu, Zhuangzhuang Hou, Xiaochen Xie, Pengrong Lin, Yongjun Huo, Yong Wang, Xiuchen Zhao
Format:	Article
Language:	English
Published:	Elsevier 2023-09-01
Series:	Journal of Materials Research and Technology
Subjects:	Sn58Bi–1Sb solder Atom migration Bi-rich phase Multi-physical fields coupling
Online Access:	http://www.sciencedirect.com/science/article/pii/S2238785423018136

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