Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique

Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique

Diamond/Cu composites are widely studied as a new generation of thermal management materials in the field of electronic packaging and heat sink materials. The surface modification of diamond can improve interfacial bonding between the diamond and Cu matrix. The Ti-coated diamond/Cu composites are pr...

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Bibliographic Details
Main Authors: Yaqiang Li, Hongyu Zhou, Chunjing Wu, Zheng Yin, Chang Liu, Junyou Liu, Zhongliang Shi
Format: Article
Language:English
Published: MDPI AG 2023-02-01
Series:Nanomaterials
Subjects:
diamond/Cu composite
thermal conductivity
surface modification
liquid-solid separation
Online Access:https://www.mdpi.com/2079-4991/13/5/878

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https://www.mdpi.com/2079-4991/13/5/878

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