Multi-objective topology optimization of porous microstructure in die-bonding layer of a semiconductor

Multi-objective topology optimization of porous microstructure in die-bonding layer of a semiconductor

ABSTRACTTo enhance semiconductor efficiency, it is imperative to develop a die-bonding material possessing exceptional thermal conductivity and stress-shielding capabilities to safeguard semiconductor components from detrimental heat and destructive stress. In this study, we employed a multi-objecti...

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Bibliographic Details
Main Authors: Jiaxin Zhou, Ikumu Watanabe, Weikang Song, Keita Kambayashi, Ta-Te Chen
Format: Article
Language:English
Published: Taylor & Francis Group 2024-12-01
Series:Science and Technology of Advanced Materials: Methods
Subjects:
Multi-objective topology optimization
microstructure design
porous microstructure
high-throughput evaluation
finite element analysis
Online Access:https://www.tandfonline.com/doi/10.1080/27660400.2024.2320691

Internet

https://www.tandfonline.com/doi/10.1080/27660400.2024.2320691

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