Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process

Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process

This paper presents the study of infrared (IR) reflow oven characteristics for suitable operating conditions of the flexible printed circuit board (FPCB) in the reflow soldering process. A computer-based model that imitates a real-time oven was developed with practical boundary conditions. Since the...

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Bibliographic Details
Main Authors: Muhammad Iqbal Ahmad, Mohd Sharizal Abdul Aziz, Mohd Zulkifly Abdullah, Mohd Arif Anuar Mohd Salleh, Mohammad Hafifi Hafiz Ishak, Wan Rahiman, Marcin Nabiałek
Format: Article
Language:English
Published: MDPI AG 2021-07-01
Series:Metals
Subjects:
surface mount technology
FPCB
reflow soldering
computational fluid dynamics
Online Access:https://www.mdpi.com/2075-4701/11/8/1155

Internet

https://www.mdpi.com/2075-4701/11/8/1155

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