Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process
This paper presents the study of infrared (IR) reflow oven characteristics for suitable operating conditions of the flexible printed circuit board (FPCB) in the reflow soldering process. A computer-based model that imitates a real-time oven was developed with practical boundary conditions. Since the...
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| Format: | Article |
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MDPI AG
2021-07-01
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| Series: | Metals |
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| Online Access: | https://www.mdpi.com/2075-4701/11/8/1155 |
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| author | Muhammad Iqbal Ahmad Mohd Sharizal Abdul Aziz Mohd Zulkifly Abdullah Mohd Arif Anuar Mohd Salleh Mohammad Hafifi Hafiz Ishak Wan Rahiman Marcin Nabiałek |
| author_facet | Muhammad Iqbal Ahmad Mohd Sharizal Abdul Aziz Mohd Zulkifly Abdullah Mohd Arif Anuar Mohd Salleh Mohammad Hafifi Hafiz Ishak Wan Rahiman Marcin Nabiałek |
| author_sort | Muhammad Iqbal Ahmad |
| collection | DOAJ |
| description | This paper presents the study of infrared (IR) reflow oven characteristics for suitable operating conditions of the flexible printed circuit board (FPCB) in the reflow soldering process. A computer-based model that imitates a real-time oven was developed with practical boundary conditions. Since the radiation effect is dominant in the reflow process, a discrete ordinate (DO) model was selected to simulate the effect. The experimental work acts as a benchmark and the reflow profile was set to follow the standards of JSTD-020E. The simulation of the model has a great consensus between the experimental data. It was found that the temperature distribution was inhomogeneous along with the phases. The FPCB surface also has a higher surface temperature than oven air during the operating reflow profile. An in-depth study using the simulation approach reveals that the temperature distribution of the desktop reflow oven is dependent on several factors, namely fan speed, FPCB position, and FPCB thickness. The rotational fan generates an unsteady flow that induces inhomogeneous temperature at different positions in the reflow oven cavity. The results are useful for studying further improvements to achieve temperature uniformity within the oven chamber. |
| first_indexed | 2024-03-10T08:35:56Z |
| format | Article |
| id | doaj.art-22f701781ebe4e6d99845c512f18345a |
| institution | Directory Open Access Journal |
| issn | 2075-4701 |
| language | English |
| last_indexed | 2024-03-10T08:35:56Z |
| publishDate | 2021-07-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Metals |
| spelling | doaj.art-22f701781ebe4e6d99845c512f18345a2023-11-22T08:40:14ZengMDPI AGMetals2075-47012021-07-01118115510.3390/met11081155Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering ProcessMuhammad Iqbal Ahmad0Mohd Sharizal Abdul Aziz1Mohd Zulkifly Abdullah2Mohd Arif Anuar Mohd Salleh3Mohammad Hafifi Hafiz Ishak4Wan Rahiman5Marcin Nabiałek6School of Mechanical Engineering, Engineering Campus, Universiti Sains Malaysia, Nibong Tebal 14300, Penang, MalaysiaSchool of Mechanical Engineering, Engineering Campus, Universiti Sains Malaysia, Nibong Tebal 14300, Penang, MalaysiaSchool of Mechanical Engineering, Engineering Campus, Universiti Sains Malaysia, Nibong Tebal 14300, Penang, MalaysiaCenter of Excellence Geopolymer and Green Technology (CEGeoGTech), Universiti Malaysia Perlis (UniMAP), Kangar 01000, Perlis, MalaysiaSchool of Aerospace Engineering, Engineering Campus, Nibong Tebal 14300, Penang, MalaysiaSchool of Electrical and Electronic Engineering, Engineering Campus, Universiti Sains Malaysia, Nibong Tebal 14300, Penang, MalaysiaDepartment of Physics, Faculty of Production Engineering and Materials Technology, Czestochowa University of Technology, 42-200 Czestochowa, PolandThis paper presents the study of infrared (IR) reflow oven characteristics for suitable operating conditions of the flexible printed circuit board (FPCB) in the reflow soldering process. A computer-based model that imitates a real-time oven was developed with practical boundary conditions. Since the radiation effect is dominant in the reflow process, a discrete ordinate (DO) model was selected to simulate the effect. The experimental work acts as a benchmark and the reflow profile was set to follow the standards of JSTD-020E. The simulation of the model has a great consensus between the experimental data. It was found that the temperature distribution was inhomogeneous along with the phases. The FPCB surface also has a higher surface temperature than oven air during the operating reflow profile. An in-depth study using the simulation approach reveals that the temperature distribution of the desktop reflow oven is dependent on several factors, namely fan speed, FPCB position, and FPCB thickness. The rotational fan generates an unsteady flow that induces inhomogeneous temperature at different positions in the reflow oven cavity. The results are useful for studying further improvements to achieve temperature uniformity within the oven chamber.https://www.mdpi.com/2075-4701/11/8/1155surface mount technologyFPCBreflow solderingcomputational fluid dynamics |
| spellingShingle | Muhammad Iqbal Ahmad Mohd Sharizal Abdul Aziz Mohd Zulkifly Abdullah Mohd Arif Anuar Mohd Salleh Mohammad Hafifi Hafiz Ishak Wan Rahiman Marcin Nabiałek Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process Metals surface mount technology FPCB reflow soldering computational fluid dynamics |
| title | Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process |
| title_full | Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process |
| title_fullStr | Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process |
| title_full_unstemmed | Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process |
| title_short | Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process |
| title_sort | investigations of infrared desktop reflow oven with fpcb substrate during reflow soldering process |
| topic | surface mount technology FPCB reflow soldering computational fluid dynamics |
| url | https://www.mdpi.com/2075-4701/11/8/1155 |
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