3D Heterogenous Integrated Wideband Switchable Bandpass Filter Bank for Millimeter Wave Applications

3D Heterogenous Integrated Wideband Switchable Bandpass Filter Bank for Millimeter Wave Applications

This article proposes a three-dimensional heterogenous-integrated (3DHI) switchable bandpass filter bank with two independent wideband filter channels that cover 26–40 GHz and 32.5–40 GHz, respectively. An accurate wafer-level process with a high hollowed ratio of the applied 8-inch high-resistivity...

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Bibliographic Details
Main Authors: Zhiyu Wang, Yujian Shu, Siyuan Ma, Xi Guo, Wei Yang, Xu Ding, Xiaofeng Lyu, Faxin Yu
Format: Article
Language:English
Published: MDPI AG 2022-12-01
Series:Electronics
Subjects:
three-dimensional heterogenous-integration (3DHI)
switchable filter bank
wafer-to-wafer (W2W) bonding
HR-Si interposer
through-silicon via (TSV)
Online Access:https://www.mdpi.com/2079-9292/12/1/194

Internet

https://www.mdpi.com/2079-9292/12/1/194

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