Seedless-electroplating Process Development for Micro-features Realization

Seedless-electroplating Process Development for Micro-features Realization

This study aims to combine the seedless-electroplating process with maskless-lithography, as an alternative for Lithografie, Galvanoformung, Abformung (LIGA) or Lithography, Electroplating and Molding with a normal, simpler, and cheaper semiconductor process with tolerable results for nickel ele...

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Bibliographic Details
Main Authors: Yudan Whulanza, Tito Sitanggang, Jos Istiyanto, Sugeng Supriadi
Format: Article
Language:English
Published: Universitas Indonesia 2015-12-01
Series:International Journal of Technology
Subjects:
LIGA, Maskless-lithography, Seedless-electroplating, Wet chemical etching
Online Access:http://ijtech.eng.ui.ac.id/article/view/1459

Internet

http://ijtech.eng.ui.ac.id/article/view/1459

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