Seedless-electroplating Process Development for Micro-features Realization
This study aims to combine the seedless-electroplating process with maskless-lithography, as an alternative for Lithografie, Galvanoformung, Abformung (LIGA) or Lithography, Electroplating and Molding with a normal, simpler, and cheaper semiconductor process with tolerable results for nickel ele...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Universitas Indonesia
2015-12-01
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| Series: | International Journal of Technology |
| Subjects: | |
| Online Access: | http://ijtech.eng.ui.ac.id/article/view/1459 |
| Summary: | This study aims to
combine the seedless-electroplating
process with maskless-lithography, as an alternative for Lithografie, Galvanoformung, Abformung (LIGA) or Lithography, Electroplating and Molding with a normal, simpler, and cheaper semiconductor
process with tolerable
results for nickel electroplating. This study reports the results of various voltages on seedless-electroplating over time, where the optimal combination occurs at an
exposure of 7.5 Volts of Direct Current (VDC) for
30 seconds. The
thickness of electroplated metal is at a range of ±1.5µm. Moreover, a
resolution of ±10µm and roughness (Ra) of ±0.31µm was achieved during the metal deposition process. |
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| ISSN: | 2086-9614 2087-2100 |