Effect of bonding temperature and bonding time on microstructure of dissimilar transient liquid phase bonding of GTD111/BNi-2/IN718 system

The effect of bonding temperature and bonding time on the microstructure of transient liquid phase (TLP) bonding named GTD111 and IN718 superalloys, using a commercial Ni–B–Cr filler alloy (BNi-2) interlayer were evaluated. The sandwich assembly was kept in a vacuum furnace at temperatures of 1050,...

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Bibliographic Details
Main Authors: Ali Izadi Ghahferokhi, Masoud Kasiri-Asgarani, Reza Ebrahimi-kahrizsangi, Mahdi Rafiei, Hamid Reza Bakhsheshi-Rad, Kamran Amini, Filippo Berto
Format: Article
Language:English
Published: Elsevier 2022-11-01
Series:Journal of Materials Research and Technology
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785422015538