Centralized Thermal Stress Oriented Dispatch Strategy for Paralleled Grid-Connected Inverters Considering Mission Profiles
One of the major failure causes in the power modules comes from the severe thermal stress in power semiconductor devices. Recently, some local control level methods have been developed to balance the power loss, dealing with the harsh mission profile, in order to reduce the thermal stress. However,...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2021-01-01
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| Series: | IEEE Open Journal of Power Electronics |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9426424/ |