Fluid flow and heat transfer behavior of a liquid based MEMS heat sink having wavy microchannels integrating circular pin-fins
MEMS heat sink having wavy microchannels integrating circular pin-fins for cooling of microelectronic chips is proposed and analyzed in this work; the pin-fins are placed at the valleys and peaks of the wavy structure. The pumping power and thermal resistance of the proposed MEMS heat sink is higher...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-11-01
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| Series: | International Journal of Thermofluids |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2666202723001957 |