Fluid flow and heat transfer behavior of a liquid based MEMS heat sink having wavy microchannels integrating circular pin-fins
MEMS heat sink having wavy microchannels integrating circular pin-fins for cooling of microelectronic chips is proposed and analyzed in this work; the pin-fins are placed at the valleys and peaks of the wavy structure. The pumping power and thermal resistance of the proposed MEMS heat sink is higher...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
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Elsevier
2023-11-01
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| Series: | International Journal of Thermofluids |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2666202723001957 |
| _version_ | 1797401611719409664 |
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| author | Anas Alkhazaleh Fadi Alnaimat Bobby Mathew |
| author_facet | Anas Alkhazaleh Fadi Alnaimat Bobby Mathew |
| author_sort | Anas Alkhazaleh |
| collection | DOAJ |
| description | MEMS heat sink having wavy microchannels integrating circular pin-fins for cooling of microelectronic chips is proposed and analyzed in this work; the pin-fins are placed at the valleys and peaks of the wavy structure. The pumping power and thermal resistance of the proposed MEMS heat sink is higher and lower than that of MEMS heat sink having straight microchannels. At Reynolds number of 250, the maximum temperature of the microelectronic chip, generating 106 W/m2, when using the proposed MEMS heat sink is only 0.77 of that when using MEMS heat sink having straight microchannels; this ratio lowers to 0.6 at Reynolds number of 1250. The thermal resistance of the proposed MEMS heat sink is only 0.72 and 0.43 of that of the MEMS heat sink having straight microchannels at Reynolds numbers of 250 and 1250, respectively. Regarding the pumping power of the proposed MEMS heat sink, it is higher than that of the MEMS heat sink having straight microchannels by 2 and 3.7 at the lowest and highest Reynolds numbers, respectively. This work also analyzes the contribution of geometric features on the behavior of the proposed MEMS heat sink in terms of maximum temperature of the microelectronic chip, thermal resistance, and pumping power as well as that of microchannel employed in the proposed MEMS heat sink in terms of Poiseuille and Nusselt numbers. Maximum temperature of the microelectronic chip and thermal resistance decrease along with increase in pumping power with increase in amplitude, diameter of pin-fins, and hydraulic diameter of microchannel as well as with decrease in wavelength. Poiseuille and Nusselt numbers increased with rise in amplitude, diameter of pin-fins, and hydraulic diameter as well as decrease in wavelength. In addition, experiments have been conducted on two designs of the proposed MEMS heat sink to generate data for purposes of validating the model. The experimental data are compared with data from simulations and the difference between the two are within the uncertainty of experimental data thereby validating the model. |
| first_indexed | 2024-03-09T02:13:25Z |
| format | Article |
| id | doaj.art-243dcef779aa4a798a4a60ca6c841cb2 |
| institution | Directory Open Access Journal |
| issn | 2666-2027 |
| language | English |
| last_indexed | 2024-03-09T02:13:25Z |
| publishDate | 2023-11-01 |
| publisher | Elsevier |
| record_format | Article |
| series | International Journal of Thermofluids |
| spelling | doaj.art-243dcef779aa4a798a4a60ca6c841cb22023-12-07T05:30:55ZengElsevierInternational Journal of Thermofluids2666-20272023-11-0120100480Fluid flow and heat transfer behavior of a liquid based MEMS heat sink having wavy microchannels integrating circular pin-finsAnas Alkhazaleh0Fadi Alnaimat1Bobby Mathew2Mechanical and Aerospace Engineering Department, United Arab Emirates University, Abu Dhabi, P. O. Box 15551, United Arab Emirates; Quantum Research Center, Technology Innovation Institute (TII), Abu Dhabi, P. O. Box 9639, United Arab EmiratesMechanical and Aerospace Engineering Department, United Arab Emirates University, Abu Dhabi, P. O. Box 15551, United Arab Emirates; National Water and Energy Center, United Arab Emirates University, Abu Dhabi, P. O. Box 15551, United Arab EmiratesMechanical and Aerospace Engineering Department, United Arab Emirates University, Abu Dhabi, P. O. Box 15551, United Arab Emirates; National Water and Energy Center, United Arab Emirates University, Abu Dhabi, P. O. Box 15551, United Arab Emirates; Corresponding author.MEMS heat sink having wavy microchannels integrating circular pin-fins for cooling of microelectronic chips is proposed and analyzed in this work; the pin-fins are placed at the valleys and peaks of the wavy structure. The pumping power and thermal resistance of the proposed MEMS heat sink is higher and lower than that of MEMS heat sink having straight microchannels. At Reynolds number of 250, the maximum temperature of the microelectronic chip, generating 106 W/m2, when using the proposed MEMS heat sink is only 0.77 of that when using MEMS heat sink having straight microchannels; this ratio lowers to 0.6 at Reynolds number of 1250. The thermal resistance of the proposed MEMS heat sink is only 0.72 and 0.43 of that of the MEMS heat sink having straight microchannels at Reynolds numbers of 250 and 1250, respectively. Regarding the pumping power of the proposed MEMS heat sink, it is higher than that of the MEMS heat sink having straight microchannels by 2 and 3.7 at the lowest and highest Reynolds numbers, respectively. This work also analyzes the contribution of geometric features on the behavior of the proposed MEMS heat sink in terms of maximum temperature of the microelectronic chip, thermal resistance, and pumping power as well as that of microchannel employed in the proposed MEMS heat sink in terms of Poiseuille and Nusselt numbers. Maximum temperature of the microelectronic chip and thermal resistance decrease along with increase in pumping power with increase in amplitude, diameter of pin-fins, and hydraulic diameter of microchannel as well as with decrease in wavelength. Poiseuille and Nusselt numbers increased with rise in amplitude, diameter of pin-fins, and hydraulic diameter as well as decrease in wavelength. In addition, experiments have been conducted on two designs of the proposed MEMS heat sink to generate data for purposes of validating the model. The experimental data are compared with data from simulations and the difference between the two are within the uncertainty of experimental data thereby validating the model.http://www.sciencedirect.com/science/article/pii/S2666202723001957Electronics coolingHeat transfer enhancementPin-finsPumping powerThermal resistanceWavy microchannels |
| spellingShingle | Anas Alkhazaleh Fadi Alnaimat Bobby Mathew Fluid flow and heat transfer behavior of a liquid based MEMS heat sink having wavy microchannels integrating circular pin-fins International Journal of Thermofluids Electronics cooling Heat transfer enhancement Pin-fins Pumping power Thermal resistance Wavy microchannels |
| title | Fluid flow and heat transfer behavior of a liquid based MEMS heat sink having wavy microchannels integrating circular pin-fins |
| title_full | Fluid flow and heat transfer behavior of a liquid based MEMS heat sink having wavy microchannels integrating circular pin-fins |
| title_fullStr | Fluid flow and heat transfer behavior of a liquid based MEMS heat sink having wavy microchannels integrating circular pin-fins |
| title_full_unstemmed | Fluid flow and heat transfer behavior of a liquid based MEMS heat sink having wavy microchannels integrating circular pin-fins |
| title_short | Fluid flow and heat transfer behavior of a liquid based MEMS heat sink having wavy microchannels integrating circular pin-fins |
| title_sort | fluid flow and heat transfer behavior of a liquid based mems heat sink having wavy microchannels integrating circular pin fins |
| topic | Electronics cooling Heat transfer enhancement Pin-fins Pumping power Thermal resistance Wavy microchannels |
| url | http://www.sciencedirect.com/science/article/pii/S2666202723001957 |
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