A Novel Temperature Drift Error Estimation Model for Capacitive MEMS Gyros Using Thermal Stress Deformation Analysis

A Novel Temperature Drift Error Estimation Model for Capacitive MEMS Gyros Using Thermal Stress Deformation Analysis

Because the conventional Temperature Drift Error (TDE) estimation model for Capacitive MEMS Gyros (CMGs) has inadequate Temperature Correlated Quantities (TCQs) and inaccurate parameter identification to improve their bias stability, its novel model based on thermal stress deformation analysis is pr...

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Bibliographic Details
Main Authors: Bing Qi, Jianhua Cheng, Zili Wang, Chao Jiang, Chun Jia
Format: Article
Language:English
Published: MDPI AG 2024-02-01
Series:Micromachines
Subjects:
capacitive MEMS Gyros
temperature dependence
thermal stress deformation analysis
TDE precise test method based on heat flux analysis
RBFNN
Online Access:https://www.mdpi.com/2072-666X/15/3/324

Internet

https://www.mdpi.com/2072-666X/15/3/324

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