Adhesion Evaluation of an Embedded SiN/GaAs Interface Using a Novel “Push-Out” Technique
Adhesion assessments of an embedded interface in a multilayer system that contains a ductile layer are challenging. The occurrence of plastic deformation in the ductile layer often leads to additional complexity in analysis. In this study, an innovative “push-out” technique was devised to evaluate t...
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-12-01
|
| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/14/1/37 |