An inverse problem to estimate simultaneously the heat source strength for multiple integrated circuit chips on a printed circuit board

An inverse problem to estimate simultaneously the heat source strength for multiple integrated circuit chips on a printed circuit board

In this three-dimensional steady-state inverse heat transfer problem, we determine the magnitude of the spatially dependent volumetric heat source originating from multiple encapsulated chips mounted on a printed circuit board (PCB). Prior to the estimations, the functional form of the multiple heat...

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Bibliographic Details
Main Authors: Cheng-Hung Huang, Ya-Rou Zhong
Format: Article
Language:English
Published: AIMS Press 2024-03-01
Series:AIMS Mathematics
Subjects:
multiple encapsulated chips
inverse problem
conjugate gradient method
heat source estimation
Online Access:https://www.aimspress.com/article/doi/10.3934/math.2024431?viewType=HTML

Internet

https://www.aimspress.com/article/doi/10.3934/math.2024431?viewType=HTML

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