An inverse problem to estimate simultaneously the heat source strength for multiple integrated circuit chips on a printed circuit board
In this three-dimensional steady-state inverse heat transfer problem, we determine the magnitude of the spatially dependent volumetric heat source originating from multiple encapsulated chips mounted on a printed circuit board (PCB). Prior to the estimations, the functional form of the multiple heat...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
AIMS Press
2024-03-01
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| Series: | AIMS Mathematics |
| Subjects: | |
| Online Access: | https://www.aimspress.com/article/doi/10.3934/math.2024431?viewType=HTML |