A Hierarchically Structured Graphene/Ag Nanowires Paper as Thermal Interface Material
With the increase in heat power density in modern integrating electronics, thermal interface materials (TIM) that can efficiently fill the gaps between the heat source and heat sinks and enhance heat dissipation are urgently needed owing to their high thermal conductivity and excellent mechanical du...
| Main Authors: | , , , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-02-01
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| Series: | Nanomaterials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-4991/13/5/793 |