A Hierarchically Structured Graphene/Ag Nanowires Paper as Thermal Interface Material
With the increase in heat power density in modern integrating electronics, thermal interface materials (TIM) that can efficiently fill the gaps between the heat source and heat sinks and enhance heat dissipation are urgently needed owing to their high thermal conductivity and excellent mechanical du...
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-02-01
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| Series: | Nanomaterials |
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| Online Access: | https://www.mdpi.com/2079-4991/13/5/793 |
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| author | Le Lv Junfeng Ying Lu Chen Peidi Tao Liwen Sun Ke Yang Li Fu Jinhong Yu Qingwei Yan Wen Dai Nan Jiang Cheng-Te Lin |
| author_facet | Le Lv Junfeng Ying Lu Chen Peidi Tao Liwen Sun Ke Yang Li Fu Jinhong Yu Qingwei Yan Wen Dai Nan Jiang Cheng-Te Lin |
| author_sort | Le Lv |
| collection | DOAJ |
| description | With the increase in heat power density in modern integrating electronics, thermal interface materials (TIM) that can efficiently fill the gaps between the heat source and heat sinks and enhance heat dissipation are urgently needed owing to their high thermal conductivity and excellent mechanical durability. Among all the emerged TIMs, graphene-based TIMs have attracted increasing attention because of the ultrahigh intrinsic thermal conductivity of graphene nanosheets. Despite extensive efforts, developing high-performance graphene-based papers with high through-plane thermal conductivity remains challenging despite their high in-plane thermal conductivity. In this study, a novel strategy for enhancing the through-plane thermal conductivity of graphene papers by in situ depositing AgNWs on graphene sheets (IGAP) was proposed, which could boost the through-plane thermal conductivity of the graphene paper up to 7.48 W m<sup>−1</sup> K<sup>−1</sup> under packaging conditions. In the TIM performance test under actual and simulated operating conditions, our IGAP exhibits strongly enhanced heat dissipation performance compared to the commercial thermal pads. We envision that our IGAP as a TIM has great potential for boosting the development of next-generation integrating circuit electronics. |
| first_indexed | 2024-03-11T07:15:17Z |
| format | Article |
| id | doaj.art-25a7ef4ce39f428998ef657cf2d7bc4b |
| institution | Directory Open Access Journal |
| issn | 2079-4991 |
| language | English |
| last_indexed | 2024-03-11T07:15:17Z |
| publishDate | 2023-02-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Nanomaterials |
| spelling | doaj.art-25a7ef4ce39f428998ef657cf2d7bc4b2023-11-17T08:16:31ZengMDPI AGNanomaterials2079-49912023-02-0113579310.3390/nano13050793A Hierarchically Structured Graphene/Ag Nanowires Paper as Thermal Interface MaterialLe Lv0Junfeng Ying1Lu Chen2Peidi Tao3Liwen Sun4Ke Yang5Li Fu6Jinhong Yu7Qingwei Yan8Wen Dai9Nan Jiang10Cheng-Te Lin11Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo 315201, ChinaKey Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo 315201, ChinaKey Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo 315201, ChinaKey Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo 315201, ChinaKey Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo 315201, ChinaKey Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo 315201, ChinaKey Laboratory of Novel Materials for Sensor of Zhejiang Province, College of Materials and Environmental Engineering, Hangzhou Dianzi University, Hangzhou 310018, ChinaKey Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo 315201, ChinaKey Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo 315201, ChinaKey Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo 315201, ChinaKey Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo 315201, ChinaKey Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo 315201, ChinaWith the increase in heat power density in modern integrating electronics, thermal interface materials (TIM) that can efficiently fill the gaps between the heat source and heat sinks and enhance heat dissipation are urgently needed owing to their high thermal conductivity and excellent mechanical durability. Among all the emerged TIMs, graphene-based TIMs have attracted increasing attention because of the ultrahigh intrinsic thermal conductivity of graphene nanosheets. Despite extensive efforts, developing high-performance graphene-based papers with high through-plane thermal conductivity remains challenging despite their high in-plane thermal conductivity. In this study, a novel strategy for enhancing the through-plane thermal conductivity of graphene papers by in situ depositing AgNWs on graphene sheets (IGAP) was proposed, which could boost the through-plane thermal conductivity of the graphene paper up to 7.48 W m<sup>−1</sup> K<sup>−1</sup> under packaging conditions. In the TIM performance test under actual and simulated operating conditions, our IGAP exhibits strongly enhanced heat dissipation performance compared to the commercial thermal pads. We envision that our IGAP as a TIM has great potential for boosting the development of next-generation integrating circuit electronics.https://www.mdpi.com/2079-4991/13/5/793graphene paperAg nanowiresthermal interface materials |
| spellingShingle | Le Lv Junfeng Ying Lu Chen Peidi Tao Liwen Sun Ke Yang Li Fu Jinhong Yu Qingwei Yan Wen Dai Nan Jiang Cheng-Te Lin A Hierarchically Structured Graphene/Ag Nanowires Paper as Thermal Interface Material Nanomaterials graphene paper Ag nanowires thermal interface materials |
| title | A Hierarchically Structured Graphene/Ag Nanowires Paper as Thermal Interface Material |
| title_full | A Hierarchically Structured Graphene/Ag Nanowires Paper as Thermal Interface Material |
| title_fullStr | A Hierarchically Structured Graphene/Ag Nanowires Paper as Thermal Interface Material |
| title_full_unstemmed | A Hierarchically Structured Graphene/Ag Nanowires Paper as Thermal Interface Material |
| title_short | A Hierarchically Structured Graphene/Ag Nanowires Paper as Thermal Interface Material |
| title_sort | hierarchically structured graphene ag nanowires paper as thermal interface material |
| topic | graphene paper Ag nanowires thermal interface materials |
| url | https://www.mdpi.com/2079-4991/13/5/793 |
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