Crack Defect Detection Processing Algorithm and Method of MEMS Devices Based on Image Processing Technology
In order to solve the problem that the crack defects generated on the surface of MEMS devices are difficult to detect under high overload impact, this paper proposes a crack detection method based on attribute weighted naive Bayes improved OTSU algorithm. Based on the analysis of the surface defects...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2023-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10311554/ |