Crack Defect Detection Processing Algorithm and Method of MEMS Devices Based on Image Processing Technology

In order to solve the problem that the crack defects generated on the surface of MEMS devices are difficult to detect under high overload impact, this paper proposes a crack detection method based on attribute weighted naive Bayes improved OTSU algorithm. Based on the analysis of the surface defects...

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Main Authors: Yu Zheng, Susu Li, Yuan Xiang, Zhenxing Zhu
Format: Article
Language:English
Published: IEEE 2023-01-01
Series:IEEE Access
Subjects:
Online Access:https://ieeexplore.ieee.org/document/10311554/
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author Yu Zheng
Susu Li
Yuan Xiang
Zhenxing Zhu
author_facet Yu Zheng
Susu Li
Yuan Xiang
Zhenxing Zhu
author_sort Yu Zheng
collection DOAJ
description In order to solve the problem that the crack defects generated on the surface of MEMS devices are difficult to detect under high overload impact, this paper proposes a crack detection method based on attribute weighted naive Bayes improved OTSU algorithm. Based on the analysis of the surface defects in MEMS devices image, the edge information of the crack defect in the image is extracted by image processing such as image detail sharpening, grayscale processing, image enhancement and edge extraction based on Canny operator, and the pseudo crack in the image is removed by the least square method; the attribute weighted naive Bayes algorithm is introduced to improve the traditional OTSU image processing method, the crack defect detection results of the MEMS devices image are obtained, the crack defects are quantitatively characterized, and the length and width of the crack defects are calculated. Comparative experiments were conducted using multiple detection methods, the results showed that the crack detection method proposed in this paper can obtain the crack defect information of MEMS devices efficiently and accurately.
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spelling doaj.art-25f06a54df384c32b06a88ef1a41a5192023-11-15T00:01:04ZengIEEEIEEE Access2169-35362023-01-011112632312633410.1109/ACCESS.2023.333115210311554Crack Defect Detection Processing Algorithm and Method of MEMS Devices Based on Image Processing TechnologyYu Zheng0https://orcid.org/0009-0005-6611-7329Susu Li1Yuan Xiang2Zhenxing Zhu3Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory, East China Institute of Photo-Electron IC, Bengbu, ChinaScience and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory, East China Institute of Photo-Electron IC, Bengbu, ChinaScience and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory, East China Institute of Photo-Electron IC, Bengbu, ChinaScience and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory, East China Institute of Photo-Electron IC, Bengbu, ChinaIn order to solve the problem that the crack defects generated on the surface of MEMS devices are difficult to detect under high overload impact, this paper proposes a crack detection method based on attribute weighted naive Bayes improved OTSU algorithm. Based on the analysis of the surface defects in MEMS devices image, the edge information of the crack defect in the image is extracted by image processing such as image detail sharpening, grayscale processing, image enhancement and edge extraction based on Canny operator, and the pseudo crack in the image is removed by the least square method; the attribute weighted naive Bayes algorithm is introduced to improve the traditional OTSU image processing method, the crack defect detection results of the MEMS devices image are obtained, the crack defects are quantitatively characterized, and the length and width of the crack defects are calculated. Comparative experiments were conducted using multiple detection methods, the results showed that the crack detection method proposed in this paper can obtain the crack defect information of MEMS devices efficiently and accurately.https://ieeexplore.ieee.org/document/10311554/MEMS devicescrack defect detectionimage segmentationquantitative characterization
spellingShingle Yu Zheng
Susu Li
Yuan Xiang
Zhenxing Zhu
Crack Defect Detection Processing Algorithm and Method of MEMS Devices Based on Image Processing Technology
IEEE Access
MEMS devices
crack defect detection
image segmentation
quantitative characterization
title Crack Defect Detection Processing Algorithm and Method of MEMS Devices Based on Image Processing Technology
title_full Crack Defect Detection Processing Algorithm and Method of MEMS Devices Based on Image Processing Technology
title_fullStr Crack Defect Detection Processing Algorithm and Method of MEMS Devices Based on Image Processing Technology
title_full_unstemmed Crack Defect Detection Processing Algorithm and Method of MEMS Devices Based on Image Processing Technology
title_short Crack Defect Detection Processing Algorithm and Method of MEMS Devices Based on Image Processing Technology
title_sort crack defect detection processing algorithm and method of mems devices based on image processing technology
topic MEMS devices
crack defect detection
image segmentation
quantitative characterization
url https://ieeexplore.ieee.org/document/10311554/
work_keys_str_mv AT yuzheng crackdefectdetectionprocessingalgorithmandmethodofmemsdevicesbasedonimageprocessingtechnology
AT susuli crackdefectdetectionprocessingalgorithmandmethodofmemsdevicesbasedonimageprocessingtechnology
AT yuanxiang crackdefectdetectionprocessingalgorithmandmethodofmemsdevicesbasedonimageprocessingtechnology
AT zhenxingzhu crackdefectdetectionprocessingalgorithmandmethodofmemsdevicesbasedonimageprocessingtechnology