The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-<i>x</i>Sb High-Temperature Lead-Free Solder
To obtain Sn-3.0Ag-0.5Cu-<i>x</i>Sb (<i>x</i> = 0, 25, 28, and 31) high-temperature lead-free solder antimony was added to Sn-3.0Ag-0.5Cu solder. The microstructure, thermal properties, and mechanical behavior of the solder alloy prepared were studied by using JSM-5610LV scan...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-10-01
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| Series: | Materials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1944/13/19/4443 |