The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-<i>x</i>Sb High-Temperature Lead-Free Solder
To obtain Sn-3.0Ag-0.5Cu-<i>x</i>Sb (<i>x</i> = 0, 25, 28, and 31) high-temperature lead-free solder antimony was added to Sn-3.0Ag-0.5Cu solder. The microstructure, thermal properties, and mechanical behavior of the solder alloy prepared were studied by using JSM-5610LV scan...
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MDPI AG
2020-10-01
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| Online Access: | https://www.mdpi.com/1996-1944/13/19/4443 |
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| author | Chaojun Li Yanfu Yan Tingting Gao Guodong Xu |
| author_facet | Chaojun Li Yanfu Yan Tingting Gao Guodong Xu |
| author_sort | Chaojun Li |
| collection | DOAJ |
| description | To obtain Sn-3.0Ag-0.5Cu-<i>x</i>Sb (<i>x</i> = 0, 25, 28, and 31) high-temperature lead-free solder antimony was added to Sn-3.0Ag-0.5Cu solder. The microstructure, thermal properties, and mechanical behavior of the solder alloy prepared were studied by using JSM-5610LV scanning electron microscope, Germany STA409PC differential scanning calorimeter, AG-I250KN universal tensile testing machine, and other methods. The SEM-EDS results showed that after adding Sb, SnSb phase was formed in the β-Sn matrix phase. The newly formed SnSb phase and the existing Sb in the solder alloy can inhibit the generation of IMC and refine the IMC layer. The addition of Sb significantly increased the melting temperature of the solder alloy. Among them, the thermal performance of Sn-3.0Ag-0.5Cu-25Sb is the best. The melting temperature of Sn-3.0Ag-0.5Cu-25Sb is 332.91 °C and the solid–liquid line range of Sn-3.0Ag-0.5Cu-25Sb solder alloy is 313.28–342.02 °C. Its pasty range is 28.74 °C, lower than 30 °C, which is beneficial for soldering. The test results of the mechanical behavior of Sn-3.0Ag-0.5Cu-<i>x</i>Sb solder alloy show that with the increase of Sb addition, the ultimate tensile strength of the solder alloy also increases. However, the change of the elongation of the solder alloy is the opposite. The ultimate tensile strength of the solder alloy increased from 29.45 MPa of Sn-3.0Ag-0.5Cu solder to 70.81 MPa of Sn-3.0Ag-0.5Cu-31Sb solder. The reason for the increase in the strength of the solder alloy is the reduction of the thickness of IMC and the solid solution hardening effect of Sb. |
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| issn | 1996-1944 |
| language | English |
| last_indexed | 2024-03-10T15:47:34Z |
| publishDate | 2020-10-01 |
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| series | Materials |
| spelling | doaj.art-260442bb3c2c42a3991c9ecdfd5b0cd72023-11-20T16:16:56ZengMDPI AGMaterials1996-19442020-10-011319444310.3390/ma13194443The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-<i>x</i>Sb High-Temperature Lead-Free SolderChaojun Li0Yanfu Yan1Tingting Gao2Guodong Xu3School of Materials Science and Engineering, Henan University of Science and Technology, Luo Yang 471000, ChinaSchool of Materials Science and Engineering, Henan University of Science and Technology, Luo Yang 471000, ChinaSchool of Materials Science and Engineering, Henan University of Science and Technology, Luo Yang 471000, ChinaSchool of Materials Science and Engineering, Henan University of Science and Technology, Luo Yang 471000, ChinaTo obtain Sn-3.0Ag-0.5Cu-<i>x</i>Sb (<i>x</i> = 0, 25, 28, and 31) high-temperature lead-free solder antimony was added to Sn-3.0Ag-0.5Cu solder. The microstructure, thermal properties, and mechanical behavior of the solder alloy prepared were studied by using JSM-5610LV scanning electron microscope, Germany STA409PC differential scanning calorimeter, AG-I250KN universal tensile testing machine, and other methods. The SEM-EDS results showed that after adding Sb, SnSb phase was formed in the β-Sn matrix phase. The newly formed SnSb phase and the existing Sb in the solder alloy can inhibit the generation of IMC and refine the IMC layer. The addition of Sb significantly increased the melting temperature of the solder alloy. Among them, the thermal performance of Sn-3.0Ag-0.5Cu-25Sb is the best. The melting temperature of Sn-3.0Ag-0.5Cu-25Sb is 332.91 °C and the solid–liquid line range of Sn-3.0Ag-0.5Cu-25Sb solder alloy is 313.28–342.02 °C. Its pasty range is 28.74 °C, lower than 30 °C, which is beneficial for soldering. The test results of the mechanical behavior of Sn-3.0Ag-0.5Cu-<i>x</i>Sb solder alloy show that with the increase of Sb addition, the ultimate tensile strength of the solder alloy also increases. However, the change of the elongation of the solder alloy is the opposite. The ultimate tensile strength of the solder alloy increased from 29.45 MPa of Sn-3.0Ag-0.5Cu solder to 70.81 MPa of Sn-3.0Ag-0.5Cu-31Sb solder. The reason for the increase in the strength of the solder alloy is the reduction of the thickness of IMC and the solid solution hardening effect of Sb.https://www.mdpi.com/1996-1944/13/19/4443high temperature lead-free soldermechanical behaviormicrostructureintermetallic compounds |
| spellingShingle | Chaojun Li Yanfu Yan Tingting Gao Guodong Xu The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-<i>x</i>Sb High-Temperature Lead-Free Solder Materials high temperature lead-free solder mechanical behavior microstructure intermetallic compounds |
| title | The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-<i>x</i>Sb High-Temperature Lead-Free Solder |
| title_full | The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-<i>x</i>Sb High-Temperature Lead-Free Solder |
| title_fullStr | The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-<i>x</i>Sb High-Temperature Lead-Free Solder |
| title_full_unstemmed | The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-<i>x</i>Sb High-Temperature Lead-Free Solder |
| title_short | The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-<i>x</i>Sb High-Temperature Lead-Free Solder |
| title_sort | microstructure thermal and mechanical properties of sn 3 0ag 0 5cu i x i sb high temperature lead free solder |
| topic | high temperature lead-free solder mechanical behavior microstructure intermetallic compounds |
| url | https://www.mdpi.com/1996-1944/13/19/4443 |
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