Study of heat transfer performance of miniature heat sink for integrated circuit packaging field

The miniature heat sink is an essential component in integrated circuit packaging, playing a vital role in ensuring the stable and reliable performance of integrated circuits. In this paper, we establish a simulation model of the heat transfer performance of a miniature heat sink with a square colum...

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Bibliographic Details
Main Authors: Zhaolong Li, Wangwang Li, Yingtao Liu, Meng Xun, Mengchen Yuan
Format: Article
Language:English
Published: Elsevier 2023-09-01
Series:Case Studies in Thermal Engineering
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2214157X23005968