Recent progress on thermal conductivity of graphene filled epoxy composites
With the rapid development of the electronic industry, the requirements for packaging materials with high thermal conductivity (TC) are getting higher and higher. Epoxy is widely used as package material for electronic package applications. But it's intrinsic TC can't meets the increasing...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
KeAi Communications Co., Ltd.
2022-09-01
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| Series: | Nano Materials Science |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2589965121000301 |