Inductively Coupled Plasma Dry Etching of Silicon Deep Trenches with Extremely Vertical Smooth Sidewalls Used in Micro-Optical Gyroscopes

Inductively Coupled Plasma Dry Etching of Silicon Deep Trenches with Extremely Vertical Smooth Sidewalls Used in Micro-Optical Gyroscopes

Micro-optical gyroscopes (MOGs) place a range of components of the fiber-optic gyroscope (FOG) onto a silicon substrate, enabling miniaturization, low cost, and batch processing. MOGs require high-precision waveguide trenches fabricated on silicon instead of the ultra-long interference ring of conve...

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Bibliographic Details
Main Authors: Yuyu Zhang, Yu Wu, Quanquan Sun, Lifeng Shen, Jie Lan, Lingxi Guo, Zhenfeng Shen, Xuefang Wang, Junfeng Xiao, Jianfeng Xu
Format: Article
Language:English
Published: MDPI AG 2023-04-01
Series:Micromachines
Subjects:
silicon deep trenches
Bosch process
pseudo-Bosch process
cryogenic etching
Online Access:https://www.mdpi.com/2072-666X/14/4/846

Internet

https://www.mdpi.com/2072-666X/14/4/846

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