Atomic layer deposition of thin films: from a chemistry perspective
Atomic layer deposition (ALD) has become an indispensable thin-film technology in the contemporary microelectronics industry. The unique self-limited layer-by-layer growth feature of ALD has outstood this technology to deposit highly uniform conformal pinhole-free thin films with angstrom-level thic...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
IOP Publishing
2023-01-01
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| Series: | International Journal of Extreme Manufacturing |
| Subjects: | |
| Online Access: | https://doi.org/10.1088/2631-7990/acd88e |