Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO<sub>2</sub> Hybrid Joints

Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO<sub>2</sub> Hybrid Joints

X-ray nanodiffraction was used to measure the thermal stress of 10 µm nanotwinned Cu bumps in Cu/SiO<sub>2</sub> hybrid structures at −55 °C, 27 °C, 100 °C, 150 °C, and 200 °C. Bonding can be achieved without externally applied compression. The X-ray beam size is about 100 nm in diameter...

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Bibliographic Details
Main Authors: Wei-You Hsu, Shih-Chi Yang, You-Yi Lin, Wan-Zhen Hsieh, King-Ning Tu, Wei-Lan Chiu, Hsiang-Hung Chang, Ching-Yu Chiang, Chih Chen
Format: Article
Language:English
Published: MDPI AG 2023-08-01
Series:Nanomaterials
Subjects:
synchrotron radiation
X-ray nanodiffraction
thermal strain distribution
Cu/SiO<sub>2</sub> hybrid bonding
nanotwinned Cu
Online Access:https://www.mdpi.com/2079-4991/13/17/2448

Internet

https://www.mdpi.com/2079-4991/13/17/2448

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