Coalescence behavior of Cu nanoparticles during sintering: Based on atomic scale to macro scale
Due to the excellent electrothermal properties, outstanding resistance to electromigration and cost-effectiveness, Cu nanoparticles are considered as a promising bonding material for high-power device. However, few studies have analyzed the coalescence behavior mechanism of Cu nanoparticles during s...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-11-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423025292 |