Coalescence behavior of Cu nanoparticles during sintering: Based on atomic scale to macro scale
Due to the excellent electrothermal properties, outstanding resistance to electromigration and cost-effectiveness, Cu nanoparticles are considered as a promising bonding material for high-power device. However, few studies have analyzed the coalescence behavior mechanism of Cu nanoparticles during s...
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| Format: | Article |
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Elsevier
2023-11-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423025292 |
| _version_ | 1827346119005306880 |
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| author | Jiaxin Liu Weishan Lv Yun Mou Cai Chen Yong Kang |
| author_facet | Jiaxin Liu Weishan Lv Yun Mou Cai Chen Yong Kang |
| author_sort | Jiaxin Liu |
| collection | DOAJ |
| description | Due to the excellent electrothermal properties, outstanding resistance to electromigration and cost-effectiveness, Cu nanoparticles are considered as a promising bonding material for high-power device. However, few studies have analyzed the coalescence behavior mechanism of Cu nanoparticles during sintering under temperature dependent conditions. In this paper, a novel method combining atomic and macroscopic scales was adopted to investigate the coalescence behavior of Cu nanoparticles. The sintering microstructure and bonding quality of Cu nanoparticles at different temperatures were evaluated via in-situ Transmission electron microscopy (TEM) heating, and the evolution of dislocations and phase transitions was analyzed. Molecular dynamics (MD) simulation was employed to characterize the atomic scale evolution of solid-state liquid sintering process of Cu nanoparticles. The role of temperature and nanoparticle size in the sintering mechanism were investigated. The results indicate that high temperature during constant temperature sintering is beneficial for the formation of stable crystal structures in the sintering neck and reduces the generation of dislocations. Shockley dislocations can contribute to the constitution of HCP stacking fault within Cu nanoparticles, which deteriorates the sintering performance. The increase in sintering temperature prompts Cu atoms at the sintering neck to migrate horizontally rather than vertically. Compared to small-sized nanoparticles, significant driving energy was required in the sintering of large-sized nanoparticles during the continuous heating process. Shockley dislocations play a dominant role in phase transition stacking fault at high temperature. Additionally, the mechanical failure forms of Cu/Nano-Cu/Cu joints at different sintering temperatures were studied and verified through MD simulation. |
| first_indexed | 2024-03-07T23:23:34Z |
| format | Article |
| id | doaj.art-2972c28bac3d479693faec767d3d56ed |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-03-07T23:23:34Z |
| publishDate | 2023-11-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj.art-2972c28bac3d479693faec767d3d56ed2024-02-21T05:26:08ZengElsevierJournal of Materials Research and Technology2238-78542023-11-012724902507Coalescence behavior of Cu nanoparticles during sintering: Based on atomic scale to macro scaleJiaxin Liu0Weishan Lv1Yun Mou2Cai Chen3Yong Kang4School of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan 430074, ChinaSchool of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, ChinaSchool of Integrated Circuits, Shen Zhen Campus of Sun Yat-sen University, Shenzhen 518107, ChinaSchool of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan 430074, China; Corresponding author.School of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan 430074, ChinaDue to the excellent electrothermal properties, outstanding resistance to electromigration and cost-effectiveness, Cu nanoparticles are considered as a promising bonding material for high-power device. However, few studies have analyzed the coalescence behavior mechanism of Cu nanoparticles during sintering under temperature dependent conditions. In this paper, a novel method combining atomic and macroscopic scales was adopted to investigate the coalescence behavior of Cu nanoparticles. The sintering microstructure and bonding quality of Cu nanoparticles at different temperatures were evaluated via in-situ Transmission electron microscopy (TEM) heating, and the evolution of dislocations and phase transitions was analyzed. Molecular dynamics (MD) simulation was employed to characterize the atomic scale evolution of solid-state liquid sintering process of Cu nanoparticles. The role of temperature and nanoparticle size in the sintering mechanism were investigated. The results indicate that high temperature during constant temperature sintering is beneficial for the formation of stable crystal structures in the sintering neck and reduces the generation of dislocations. Shockley dislocations can contribute to the constitution of HCP stacking fault within Cu nanoparticles, which deteriorates the sintering performance. The increase in sintering temperature prompts Cu atoms at the sintering neck to migrate horizontally rather than vertically. Compared to small-sized nanoparticles, significant driving energy was required in the sintering of large-sized nanoparticles during the continuous heating process. Shockley dislocations play a dominant role in phase transition stacking fault at high temperature. Additionally, the mechanical failure forms of Cu/Nano-Cu/Cu joints at different sintering temperatures were studied and verified through MD simulation.http://www.sciencedirect.com/science/article/pii/S2238785423025292Cu nanoparticlesSinteringIn-situ TEM heatingMolecular dynamics simulationHCP stacking faultMechanical failure forms |
| spellingShingle | Jiaxin Liu Weishan Lv Yun Mou Cai Chen Yong Kang Coalescence behavior of Cu nanoparticles during sintering: Based on atomic scale to macro scale Journal of Materials Research and Technology Cu nanoparticles Sintering In-situ TEM heating Molecular dynamics simulation HCP stacking fault Mechanical failure forms |
| title | Coalescence behavior of Cu nanoparticles during sintering: Based on atomic scale to macro scale |
| title_full | Coalescence behavior of Cu nanoparticles during sintering: Based on atomic scale to macro scale |
| title_fullStr | Coalescence behavior of Cu nanoparticles during sintering: Based on atomic scale to macro scale |
| title_full_unstemmed | Coalescence behavior of Cu nanoparticles during sintering: Based on atomic scale to macro scale |
| title_short | Coalescence behavior of Cu nanoparticles during sintering: Based on atomic scale to macro scale |
| title_sort | coalescence behavior of cu nanoparticles during sintering based on atomic scale to macro scale |
| topic | Cu nanoparticles Sintering In-situ TEM heating Molecular dynamics simulation HCP stacking fault Mechanical failure forms |
| url | http://www.sciencedirect.com/science/article/pii/S2238785423025292 |
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