Tear-and-Interconnect Domain Decomposition Scheme for Solving Multiscale Composite Penetrable Objects

Tear-and-Interconnect Domain Decomposition Scheme for Solving Multiscale Composite Penetrable Objects

In this work, the tear-and-interconnect (T&I) surface-integral-equation (SIE) domain-decomposition (DD) approach-previously developed for non-penetrable bodies-, is extended to composite piecewise homogeneous penetrable objects including multiple materials and multiscale features. The main a...

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Bibliographic Details
Main Authors: Victor F. Martin, David Larios, Diego M. Solis, Jose M. Taboada, Luis Landesa, Fernando Obelleiro
Format: Article
Language:English
Published: IEEE 2020-01-01
Series:IEEE Access
Subjects:
Dielectrics
domain decomposition (DD)
fast solvers
surface integral equations (SIE)
Maxwell’s equations
method of moments (MoM)
Online Access:https://ieeexplore.ieee.org/document/9110559/

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https://ieeexplore.ieee.org/document/9110559/

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