Dual-wafer intergrinding thinning by bipolar-discharge EDM with a capacity-coupled pulse generator considering large gap capacitance and minimization of discharge energy
The noncontact electrical discharge grinding technique has the potential to effectively grind thin, increasingly large-diameter wafers. This study proposes a bipolar electrical discharge machining (bipolar-EDM) method to realize the intergrinding of dual wafers, in which both wafers serve as the wor...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-09-01
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| Series: | Results in Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2590123022001967 |