A Study on the Interfacial Reactions between Gallium and Cu/Ni/Au(Pd) Multilayer Metallization

A Study on the Interfacial Reactions between Gallium and Cu/Ni/Au(Pd) Multilayer Metallization

This research introduces low-temperature soldering of Ga with practical metallization structures, namely, Cu/Ni/Pd and Cu/Ni/Au, applied to contemporary microelectronic packages. Through these multilayer configurations, the study investigates the stability of the Ni diffusion barrier by examining ch...

Full description

Bibliographic Details
Main Authors: Byungwoo Kim, Chang-Lae Kim, Yoonchul Sohn
Format: Article
Language:English
Published: MDPI AG 2023-09-01
Series:Materials
Subjects:
gallium
intermetallic compound
interfacial reaction
X-ray diffraction
scanning electron microscopy
Online Access:https://www.mdpi.com/1996-1944/16/18/6186

Internet

https://www.mdpi.com/1996-1944/16/18/6186

Similar Items