Enhanced Adhesion of Copper Films on Fused Silica Glass Substrate by Plasma Pre-Treatment
A non-thermal atmospheric jet plasma pre-treatment technique was introduced to help the growth of extremely sticky copper films on fused silica glass substrates. A tape test was utilized to assess the bonding quality between copper films and fused silica glass substrates. AFM was used to characteriz...
Main Authors: | , , , , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2023-07-01
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Series: | Materials |
Subjects: | |
Online Access: | https://www.mdpi.com/1996-1944/16/14/5152 |