Enhanced Adhesion of Copper Films on Fused Silica Glass Substrate by Plasma Pre-Treatment

A non-thermal atmospheric jet plasma pre-treatment technique was introduced to help the growth of extremely sticky copper films on fused silica glass substrates. A tape test was utilized to assess the bonding quality between copper films and fused silica glass substrates. AFM was used to characteriz...

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Bibliographic Details
Main Authors: Liqing Yang, Xianli Yang, Fei Gao, Yongmao Guan, Rui Wan, Pengfei Wang
Format: Article
Language:English
Published: MDPI AG 2023-07-01
Series:Materials
Subjects:
Online Access:https://www.mdpi.com/1996-1944/16/14/5152