Adhesion analysis of silane coupling agent/copper interface with density functional theory
Nanotechnology devices with strong adhesion strength are required due to the miniaturization and reduction of the thickness of electronic devices. This paper describes a technique to select a silane coupling agent effective for obtaining the strong adhesion with copper by use of a density functional...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
The Japan Society of Mechanical Engineers
2014-08-01
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| Series: | Mechanical Engineering Journal |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/mej/1/4/1_2014smm0032/_pdf/-char/en |