Through-Silicon via Device Non-Destructive Defect Evaluation Using Ultra-High-Resolution Acoustic Microscopy System

Through-Silicon via Device Non-Destructive Defect Evaluation Using Ultra-High-Resolution Acoustic Microscopy System

In this study, an ultra-high-resolution acoustic microscopy system capable of non-destructively evaluating defects that may occur in thin film structures was fabricated. It is an integrated system of the control module, activation module, and data acquisition system, in which an integrated control s...

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Bibliographic Details
Main Authors: Tae Hyeong Kim, Dongchan Kang, Jeong Nyeon Kim, Ik Keun Park
Format: Article
Language:English
Published: MDPI AG 2023-01-01
Series:Materials
Subjects:
TSV device
acoustic microscopy system
semiconductor
internal defect
Online Access:https://www.mdpi.com/1996-1944/16/2/860

Internet

https://www.mdpi.com/1996-1944/16/2/860

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