An Experimental and Numerical Study on Glass Frit Wafer-to-Wafer Bonding
A thermo-mechanical wafer-to-wafer bonding process is studied through experiments on the glass frit material and thermo-mechanical numerical simulations to evaluate the effect of the residual stresses on the wafer warpage. To experimentally characterize the material, confocal laser profilometry and...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-01-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/14/1/165 |