Substrate‐Free Transfer of Large‐Area Ultra‐Thin Electronics
Abstract Innovation in materials and technologies has promoted the fabrication of thin‐film electronics on substrates previously considered incompatible because of their chemical or mechanical properties. Indeed, conventional fabrication processes, typically based on photolithography, involve solven...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley-VCH
2023-09-01
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| Series: | Advanced Electronic Materials |
| Subjects: | |
| Online Access: | https://doi.org/10.1002/aelm.202201281 |