Substrate‐Free Transfer of Large‐Area Ultra‐Thin Electronics
Abstract Innovation in materials and technologies has promoted the fabrication of thin‐film electronics on substrates previously considered incompatible because of their chemical or mechanical properties. Indeed, conventional fabrication processes, typically based on photolithography, involve solven...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley-VCH
2023-09-01
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| Series: | Advanced Electronic Materials |
| Subjects: | |
| Online Access: | https://doi.org/10.1002/aelm.202201281 |
| _version_ | 1797688357637062656 |
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| author | Hugo De Souza Oliveira Federica Catania Albert Heinrich Lanthaler Alejandro Carrasco‐Pena Giuseppe Cantarella Niko Münzenrieder |
| author_facet | Hugo De Souza Oliveira Federica Catania Albert Heinrich Lanthaler Alejandro Carrasco‐Pena Giuseppe Cantarella Niko Münzenrieder |
| author_sort | Hugo De Souza Oliveira |
| collection | DOAJ |
| description | Abstract Innovation in materials and technologies has promoted the fabrication of thin‐film electronics on substrates previously considered incompatible because of their chemical or mechanical properties. Indeed, conventional fabrication processes, typically based on photolithography, involve solvents and acids that might harm fragile or exotic substrates. In this context, transfer techniques define a route to overcome the issues related to the nature of the substrate by using supportive carriers in the electronics stack that mitigate or avoid any damages during the fabrication process. Here, a substrate‐free approach is presented for the transfer of ultra‐thin electronics (<150nm‐thick) where no additional layer besides the electronics one remains on the final substrate. Devices are transferred on several surfaces showing good adhesion and an average performance variation of 27%. Furthermore, a sensor bent to a radius of 15.25µm, shows variation in performance of 5%. The technique can also be sequentially repeated for the fabrication of stacked electronics, enabling the development of ultra‐thin devices, compliant on unconventional surfaces. |
| first_indexed | 2024-03-12T01:30:00Z |
| format | Article |
| id | doaj.art-2bce511b7ba14c2ea1a0a0f174f0bbe9 |
| institution | Directory Open Access Journal |
| issn | 2199-160X |
| language | English |
| last_indexed | 2024-03-12T01:30:00Z |
| publishDate | 2023-09-01 |
| publisher | Wiley-VCH |
| record_format | Article |
| series | Advanced Electronic Materials |
| spelling | doaj.art-2bce511b7ba14c2ea1a0a0f174f0bbe92023-09-12T05:36:18ZengWiley-VCHAdvanced Electronic Materials2199-160X2023-09-0199n/an/a10.1002/aelm.202201281Substrate‐Free Transfer of Large‐Area Ultra‐Thin ElectronicsHugo De Souza Oliveira0Federica Catania1Albert Heinrich Lanthaler2Alejandro Carrasco‐Pena3Giuseppe Cantarella4Niko Münzenrieder5Faculty of Engineering Free University of Bozen‐Bolzano Bozen‐Bolzano 39100 ItalyFaculty of Engineering Free University of Bozen‐Bolzano Bozen‐Bolzano 39100 ItalyFaculty of Engineering Free University of Bozen‐Bolzano Bozen‐Bolzano 39100 ItalyFaculty of Engineering Free University of Bozen‐Bolzano Bozen‐Bolzano 39100 ItalyFaculty of Engineering Free University of Bozen‐Bolzano Bozen‐Bolzano 39100 ItalyFaculty of Engineering Free University of Bozen‐Bolzano Bozen‐Bolzano 39100 ItalyAbstract Innovation in materials and technologies has promoted the fabrication of thin‐film electronics on substrates previously considered incompatible because of their chemical or mechanical properties. Indeed, conventional fabrication processes, typically based on photolithography, involve solvents and acids that might harm fragile or exotic substrates. In this context, transfer techniques define a route to overcome the issues related to the nature of the substrate by using supportive carriers in the electronics stack that mitigate or avoid any damages during the fabrication process. Here, a substrate‐free approach is presented for the transfer of ultra‐thin electronics (<150nm‐thick) where no additional layer besides the electronics one remains on the final substrate. Devices are transferred on several surfaces showing good adhesion and an average performance variation of 27%. Furthermore, a sensor bent to a radius of 15.25µm, shows variation in performance of 5%. The technique can also be sequentially repeated for the fabrication of stacked electronics, enabling the development of ultra‐thin devices, compliant on unconventional surfaces.https://doi.org/10.1002/aelm.202201281flexible electronicssubstrate‐freetransfer techniquesultra‐thin electronics |
| spellingShingle | Hugo De Souza Oliveira Federica Catania Albert Heinrich Lanthaler Alejandro Carrasco‐Pena Giuseppe Cantarella Niko Münzenrieder Substrate‐Free Transfer of Large‐Area Ultra‐Thin Electronics Advanced Electronic Materials flexible electronics substrate‐free transfer techniques ultra‐thin electronics |
| title | Substrate‐Free Transfer of Large‐Area Ultra‐Thin Electronics |
| title_full | Substrate‐Free Transfer of Large‐Area Ultra‐Thin Electronics |
| title_fullStr | Substrate‐Free Transfer of Large‐Area Ultra‐Thin Electronics |
| title_full_unstemmed | Substrate‐Free Transfer of Large‐Area Ultra‐Thin Electronics |
| title_short | Substrate‐Free Transfer of Large‐Area Ultra‐Thin Electronics |
| title_sort | substrate free transfer of large area ultra thin electronics |
| topic | flexible electronics substrate‐free transfer techniques ultra‐thin electronics |
| url | https://doi.org/10.1002/aelm.202201281 |
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