Post-Release Deformation and Motion Control of Photonic Waveguide Beams by Tuneable Electrothermal Actuators in Thick SiO2

Post-Release Deformation and Motion Control of Photonic Waveguide Beams by Tuneable Electrothermal Actuators in Thick SiO2

Photonic packaging, which includes high-precision assembly of photonic sub-systems, is currently a bottleneck in the development of commercially-available integrated photonic products. In the pursuit of a fully-automated, high-precision, and cost-effective photonic alignment scheme for two multi-cha...

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Bibliographic Details
Main Authors: Kai Wu, Marcel Tichem
Format: Article
Language:English
Published: MDPI AG 2018-09-01
Series:Micromachines
Subjects:
photonic packaging
flip-chip assembly
silicon dioxide
polycrystalline silicon
MEMS
bimorph actuator
electrothermal actuator
multilayer beam
post-release deformation
out-of-plane motion
photonic waveguide alignment
Online Access:http://www.mdpi.com/2072-666X/9/10/496

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http://www.mdpi.com/2072-666X/9/10/496

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