Scalable Silicone Composites for Thermal Management in Flexible Stretchable Electronics

Hexagonal boron nitride (<i>h</i>BN) has been incorporated, as an active filler, in a customized silicone matrix to obtain high thermal conductivity composites, maintaining high flexibility and low dielectric permittivity, which are of interest for heat dissipation in energy storage syst...

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Bibliographic Details
Main Authors: George-Theodor Stiubianu, Adrian Bele, Marian Grigoras, Codrin Tugui, Bianca-Iulia Ciubotaru, Mirela-Fernanda Zaltariov, Firuța Borza, Leandru-Gheorghe Bujoreanu, Maria Cazacu
Format: Article
Language:English
Published: MDPI AG 2022-08-01
Series:Batteries
Subjects:
Online Access:https://www.mdpi.com/2313-0105/8/8/95