Scalable Silicone Composites for Thermal Management in Flexible Stretchable Electronics
Hexagonal boron nitride (<i>h</i>BN) has been incorporated, as an active filler, in a customized silicone matrix to obtain high thermal conductivity composites, maintaining high flexibility and low dielectric permittivity, which are of interest for heat dissipation in energy storage syst...
Main Authors: | , , , , , , , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2022-08-01
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Series: | Batteries |
Subjects: | |
Online Access: | https://www.mdpi.com/2313-0105/8/8/95 |