Effect of Warm Crossing Rolling on the Microstructure, Texture and Annealing Behavior of High-Purity Tantalum

With advanced integrated circuit semiconductor chips, the uniformity of microstructure and texture is increasingly required for tantalum (Ta) targets. A combination of warm rolling and 135° cross rolling (CR) at the temperature of 500 °C and 800 °C, i.e., warm cross rolling (WCR), was carried out in...

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Main Authors: Yuping Ding, Song Wang, Min Zhang, Shiyuan Zhou, Shifeng Liu, Xiaoli Yuan
Format: Article
Language:English
Published: MDPI AG 2023-04-01
Series:Metals
Subjects:
Online Access:https://www.mdpi.com/2075-4701/13/5/838
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author Yuping Ding
Song Wang
Min Zhang
Shiyuan Zhou
Shifeng Liu
Xiaoli Yuan
author_facet Yuping Ding
Song Wang
Min Zhang
Shiyuan Zhou
Shifeng Liu
Xiaoli Yuan
author_sort Yuping Ding
collection DOAJ
description With advanced integrated circuit semiconductor chips, the uniformity of microstructure and texture is increasingly required for tantalum (Ta) targets. A combination of warm rolling and 135° cross rolling (CR) at the temperature of 500 °C and 800 °C, i.e., warm cross rolling (WCR), was carried out in tantalum (Ta) plates to investigate the evolution of deformed microstructure and texture. Subsequently, these rolled samples were annealed to analyze the recrystallized microstructure. Results exhibited that WCR samples formed a relatively uniform and weak texture distribution along the thickness direction. The reduction in the proportion of low-angle grain boundaries (LAGBs) was associated with the lower Peierls stresses to be overcome for dislocation motion due to thermal activation in the WCR sample. High grain boundary energy was observed in WCR samples, and WCR can promote dynamic recovery of samples to produce sub-crystals (thermodynamically unstable and serving as nuclei for subsequent recrystallization). Fine average grain size and high content of recrystallized grains with random orientation were obtained after annealing in the WCR sample. This study will provide a theoretical reference for the precise optimization of tantalum process parameters and the improvement in the target material’s performance.
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spelling doaj.art-2cd68449d5d24af09878c8107fb830cc2023-11-18T02:26:33ZengMDPI AGMetals2075-47012023-04-0113583810.3390/met13050838Effect of Warm Crossing Rolling on the Microstructure, Texture and Annealing Behavior of High-Purity TantalumYuping Ding0Song Wang1Min Zhang2Shiyuan Zhou3Shifeng Liu4Xiaoli Yuan5College of Materials Science and Engineering, Chongqing University, Chongqing 400044, ChinaCollege of Materials Science and Engineering, Chongqing University, Chongqing 400044, ChinaCollege of Materials Science and Engineering, Chongqing University, Chongqing 400044, ChinaCollege of Materials Science and Engineering, Chongqing University, Chongqing 400044, ChinaCollege of Materials Science and Engineering, Chongqing University, Chongqing 400044, ChinaSchool of Metallurgy and Material Engineering, Chongqing University of Science and Technology, Chongqing 401331, ChinaWith advanced integrated circuit semiconductor chips, the uniformity of microstructure and texture is increasingly required for tantalum (Ta) targets. A combination of warm rolling and 135° cross rolling (CR) at the temperature of 500 °C and 800 °C, i.e., warm cross rolling (WCR), was carried out in tantalum (Ta) plates to investigate the evolution of deformed microstructure and texture. Subsequently, these rolled samples were annealed to analyze the recrystallized microstructure. Results exhibited that WCR samples formed a relatively uniform and weak texture distribution along the thickness direction. The reduction in the proportion of low-angle grain boundaries (LAGBs) was associated with the lower Peierls stresses to be overcome for dislocation motion due to thermal activation in the WCR sample. High grain boundary energy was observed in WCR samples, and WCR can promote dynamic recovery of samples to produce sub-crystals (thermodynamically unstable and serving as nuclei for subsequent recrystallization). Fine average grain size and high content of recrystallized grains with random orientation were obtained after annealing in the WCR sample. This study will provide a theoretical reference for the precise optimization of tantalum process parameters and the improvement in the target material’s performance.https://www.mdpi.com/2075-4701/13/5/838microstructuretexturewarm cross rollingannealingtantalum
spellingShingle Yuping Ding
Song Wang
Min Zhang
Shiyuan Zhou
Shifeng Liu
Xiaoli Yuan
Effect of Warm Crossing Rolling on the Microstructure, Texture and Annealing Behavior of High-Purity Tantalum
Metals
microstructure
texture
warm cross rolling
annealing
tantalum
title Effect of Warm Crossing Rolling on the Microstructure, Texture and Annealing Behavior of High-Purity Tantalum
title_full Effect of Warm Crossing Rolling on the Microstructure, Texture and Annealing Behavior of High-Purity Tantalum
title_fullStr Effect of Warm Crossing Rolling on the Microstructure, Texture and Annealing Behavior of High-Purity Tantalum
title_full_unstemmed Effect of Warm Crossing Rolling on the Microstructure, Texture and Annealing Behavior of High-Purity Tantalum
title_short Effect of Warm Crossing Rolling on the Microstructure, Texture and Annealing Behavior of High-Purity Tantalum
title_sort effect of warm crossing rolling on the microstructure texture and annealing behavior of high purity tantalum
topic microstructure
texture
warm cross rolling
annealing
tantalum
url https://www.mdpi.com/2075-4701/13/5/838
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AT shiyuanzhou effectofwarmcrossingrollingonthemicrostructuretextureandannealingbehaviorofhighpuritytantalum
AT shifengliu effectofwarmcrossingrollingonthemicrostructuretextureandannealingbehaviorofhighpuritytantalum
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