Reliability Behavior of A Resin-Free Nanosilver Paste at Ultra-Low Temperature of 180°C
In this paper, excellent thermo-mechanical reliability of resin-free silver sintering for large-area (20 × 20 mm2) bonding was successfully achieved by using a trimodal particle system composed of nano-, submicron-, and micron-sized Ag particles. After 1000 cycles of the thermal shock (TS) test, the...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-10-01
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| Series: | Power Electronic Devices and Components |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2772370422000116 |