Microstructure, adhesion strength and thermal conductivity of AlN/(Ti, W)/Cu substrate system
AlN/(Ti, W)/Cu substrates were successfully fabricated by the combination of magnetron sputtering and electroless copper plating, exhibited layered distribution without obvious defects or delamination. The adhesion film in AlN/Ti/Cu was composed of TiN, Al, and Ti crystallites due to the reaction be...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IOP Publishing
2020-01-01
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| Series: | Materials Research Express |
| Subjects: | |
| Online Access: | https://doi.org/10.1088/2053-1591/abc0a3 |