Microstructure, adhesion strength and thermal conductivity of AlN/(Ti, W)/Cu substrate system
AlN/(Ti, W)/Cu substrates were successfully fabricated by the combination of magnetron sputtering and electroless copper plating, exhibited layered distribution without obvious defects or delamination. The adhesion film in AlN/Ti/Cu was composed of TiN, Al, and Ti crystallites due to the reaction be...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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IOP Publishing
2020-01-01
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| Series: | Materials Research Express |
| Subjects: | |
| Online Access: | https://doi.org/10.1088/2053-1591/abc0a3 |
| _version_ | 1797746864817176576 |
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| author | Yingfei Lin Yangyang Hao Jianning Lu Tianlong Liu |
| author_facet | Yingfei Lin Yangyang Hao Jianning Lu Tianlong Liu |
| author_sort | Yingfei Lin |
| collection | DOAJ |
| description | AlN/(Ti, W)/Cu substrates were successfully fabricated by the combination of magnetron sputtering and electroless copper plating, exhibited layered distribution without obvious defects or delamination. The adhesion film in AlN/Ti/Cu was composed of TiN, Al, and Ti crystallites due to the reaction between the sputtered Ti layer and the AlN substrate, while in AlN/W/Cu was α -W and β -W crystallites with a mixed distribution but a thin W-rich amorphous layer at the interface towards Cu contact. In AlN/TiW/Cu was W-rich Ti _x W _1−x and α -Ti with the interlayer distribution. The scratch failure of the AlN/(Ti, W)/Cu substrates included the peeling of the Cu plating layer and adhesion film. The nanoscale hard phase layered combination of the adhesion film in AlN/TiW/Cu exhibited better peeling resistance, resulting in the most prominent adhesion strength among the substrate system. The existence of an amorphous layer in AlN/W/Cu led to the lower thermal conductivity. AlN/TiW/Cu substrate showed good comprehensive properties including adhesion strength and thermal conductivity. |
| first_indexed | 2024-03-12T15:43:53Z |
| format | Article |
| id | doaj.art-2d21e920bd7044a39cd87afa7a2659ac |
| institution | Directory Open Access Journal |
| issn | 2053-1591 |
| language | English |
| last_indexed | 2024-03-12T15:43:53Z |
| publishDate | 2020-01-01 |
| publisher | IOP Publishing |
| record_format | Article |
| series | Materials Research Express |
| spelling | doaj.art-2d21e920bd7044a39cd87afa7a2659ac2023-08-09T15:51:25ZengIOP PublishingMaterials Research Express2053-15912020-01-0171010640410.1088/2053-1591/abc0a3Microstructure, adhesion strength and thermal conductivity of AlN/(Ti, W)/Cu substrate systemYingfei Lin0https://orcid.org/0000-0002-0353-5436Yangyang Hao1Jianning Lu2Tianlong Liu3Institute of Materials and Processing, Guangdong Academy of Sciences, Guangzhou 510650, People’s Republic of China; Guangdong Provincial Key Laboratory of Metal Toughening Technology and Application, Guangzhou 510650, People’s Republic of China; Meizhou Yueke Institute of New Materials and Green Manufacturing, Meizhou 514768, People’s Republic of ChinaInstitute of Materials and Processing, Guangdong Academy of Sciences, Guangzhou 510650, People’s Republic of ChinaInstitute of Materials and Processing, Guangdong Academy of Sciences, Guangzhou 510650, People’s Republic of China; Guangdong Provincial Key Laboratory of Metal Toughening Technology and Application, Guangzhou 510650, People’s Republic of China; Meizhou Yueke Institute of New Materials and Green Manufacturing, Meizhou 514768, People’s Republic of ChinaInstitute of Materials and Processing, Guangdong Academy of Sciences, Guangzhou 510650, People’s Republic of China; Guangdong Provincial Key Laboratory of Metal Toughening Technology and Application, Guangzhou 510650, People’s Republic of China; Meizhou Yueke Institute of New Materials and Green Manufacturing, Meizhou 514768, People’s Republic of ChinaAlN/(Ti, W)/Cu substrates were successfully fabricated by the combination of magnetron sputtering and electroless copper plating, exhibited layered distribution without obvious defects or delamination. The adhesion film in AlN/Ti/Cu was composed of TiN, Al, and Ti crystallites due to the reaction between the sputtered Ti layer and the AlN substrate, while in AlN/W/Cu was α -W and β -W crystallites with a mixed distribution but a thin W-rich amorphous layer at the interface towards Cu contact. In AlN/TiW/Cu was W-rich Ti _x W _1−x and α -Ti with the interlayer distribution. The scratch failure of the AlN/(Ti, W)/Cu substrates included the peeling of the Cu plating layer and adhesion film. The nanoscale hard phase layered combination of the adhesion film in AlN/TiW/Cu exhibited better peeling resistance, resulting in the most prominent adhesion strength among the substrate system. The existence of an amorphous layer in AlN/W/Cu led to the lower thermal conductivity. AlN/TiW/Cu substrate showed good comprehensive properties including adhesion strength and thermal conductivity.https://doi.org/10.1088/2053-1591/abc0a3coating materialsAlN/(TiW)/Cu substratesmicrostructureadhesion strengthheat conduction |
| spellingShingle | Yingfei Lin Yangyang Hao Jianning Lu Tianlong Liu Microstructure, adhesion strength and thermal conductivity of AlN/(Ti, W)/Cu substrate system Materials Research Express coating materials AlN/(Ti W)/Cu substrates microstructure adhesion strength heat conduction |
| title | Microstructure, adhesion strength and thermal conductivity of AlN/(Ti, W)/Cu substrate system |
| title_full | Microstructure, adhesion strength and thermal conductivity of AlN/(Ti, W)/Cu substrate system |
| title_fullStr | Microstructure, adhesion strength and thermal conductivity of AlN/(Ti, W)/Cu substrate system |
| title_full_unstemmed | Microstructure, adhesion strength and thermal conductivity of AlN/(Ti, W)/Cu substrate system |
| title_short | Microstructure, adhesion strength and thermal conductivity of AlN/(Ti, W)/Cu substrate system |
| title_sort | microstructure adhesion strength and thermal conductivity of aln ti w cu substrate system |
| topic | coating materials AlN/(Ti W)/Cu substrates microstructure adhesion strength heat conduction |
| url | https://doi.org/10.1088/2053-1591/abc0a3 |
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