Low-temperature densification and microstructure of W–Cu composites with Sn additives
Dense and homogeneous W–Cu composites with high strength were successfully prepared from Cu-coated W powders by hot pressure sintering (800 °C) with Sn as activated additives. The relative density, microstructure and properties of W–Cu composites with Sn additives were studied. The results have indi...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-01-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785420320901 |